1. diamond wire thin wire is the key to reduce cost, tungsten wire bus has obvious advantages.

(I) diamond wire: a "sharp weapon" for photovoltaic silicon wafer cutting"

The diamond wire is a linear super-hard material cutting tool, the structure includes the bus substrate, nickel coating, diamond powder particles, the main production process is: the method of electroplating on the steel wire substrate to deposit a layer of metal nickel, metal nickel layer wrapped with diamond particles, so that the diamond particles consolidated on the steel wire substrate. The demand for the downstream application of diamond lines in the photovoltaic field accounts for more than 90%. Can be used for silicon rod truncation, silicon ingot square, silicon wafer cutting. The principle of diamond wire cutting is that the diamond wire is pressed on the surface of the silicon material, and the diamond particles consolidated on the steel wire substrate move rapidly under the drive of the steel wire, resulting in a grinding effect, grinding away part of the silicon material, forming a "knife gap", so as to achieve the purpose of cutting.

Domestic production of diamond line head enterprises include Meichang shares, high-test shares, star technology, Daile new materials, three super-new materials, Tony electronics, etc., the overall pattern is more concentrated. The main enterprises have achieved mass production of the diamond wire bus mainstream diameter range of 36 to 40um, and the products below 35um are still in small batch testing or reserve.

The key to (II) silicon consumption reduction, the trend of fine-line determination.

Diamond wire in the photovoltaic industry chain as an auxiliary material for silicon wafer production, located in the upstream of the industry chain, its technical performance directly affects the quality of silicon wafers and the manufacturing cost of photovoltaic modules, is the core technical link of photovoltaic enterprises to reduce the cost. The cost of monocrystalline silicon wafers mainly includes three parts:(1) silicon material link: mainly silicon material procurement cost (55%); (2) Rod pulling link: mainly includes consumables (crucible, thermal field system, argon, etc., accounting for 10.8 of the total), electricity (4.95), equipment depreciation (3.6) and other costs (2.7);(3) Slicing: it mainly includes consumables (square line, diamond line, cutting fluid, etc., accounting for 11.5 per cent of the total), electricity (4.95 per cent), equipment depreciation (3.6 per cent), labor and other costs (1.8 per cent).