What is the impact of low temperature glass carbon bonding technology on the study of diamond molds?
Release time:
2022-05-27
Source:
The representative of a new generation of semiconductor materials-diamond, mainly for a new generation of electronic, microwave RF and optoelectronic applications.
It has broad application prospects in the fields of new generation mobile communications, new energy grid connection, smart grid, high-speed rail transit, new energy vehicles, etc., and has gradually become a new strategic highland for the development of the global semiconductor industry.
With the rapid development of global semiconductor materials, high-precision machining of semiconductor substrate materials has become the key to the preparation of advanced chip devices.
Because these semiconductor materials generally have the characteristics of high hardness and stable chemical properties, they are difficult to process.
The subsequent epitaxial process puts forward higher requirements for the processing of the substrate surface, so the development of high-performance superhard grinding tools and corresponding high-precision processing technology has become an important prerequisite for the development of advanced chips.
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