Special powder for diamond cutting line
Using high-strength, high-hardness brittle series of high-quality diamond raw materials, through special processing procedures, the particle size distribution is more concentrated, the crystal form is massive, angular, micro-powder particle strength is high, effective grinding particles, impurity content is very low, with good sharpness, wear resistance.
Classification:
Diamond crushing material
Key words:
grinding
Product characteristics
Using high-strength, high-hardness brittle series of high-quality diamond raw materials, through special processing procedures, the particle size distribution is more concentrated, the crystal form is massive, angular, micro-powder particle strength is high, effective grinding particles, impurity content is very low, with good sharpness, wear resistance.
Application areas
Diamond wire saw is suitable for cutting and grinding monocrystalline silicon wafer, polycrystalline silicon wafer, high-precision magnetic materials, jewelry and jade materials and high-precision ceramic materials. It is also suitable for rough grinding and fine grinding of sapphire, quartz, liquid crystal glass, high-precision magnetic materials, jewelry and jade materials, and high-precision ceramics.
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