Special powder for diamond cutting line/Sic crystal cutting special powder
The use of high-strength, high-hardness brittle series of high-quality diamond raw materials, through the crushing, shaping, grading process of strict special process control, product particle size distribution is concentrated, the impurity content is very low, crystal form is massive, angular, keep the sharpness of particles, effective grinding particles, better removal of invalid flake particles, improve processing efficiency and product yield.
Classification:
Diamond powder
Key words:
Crystal cutting powder
Product characteristics
The use of high-strength, high-hardness brittle series of high-quality diamond raw materials, through the crushing, shaping, grading process of strict special process control, product particle size distribution is concentrated, the impurity content is very low, crystal form is massive, angular, keep the sharpness of particles, effective grinding particles, better removal of invalid flake particles, improve processing efficiency and product yield.
Available particle size range: DLM-W4.0um-DLM-W 60μm
Application areas
Diamond wire saw powder is suitable for single crystal silicon, polycrystalline silicon, sapphire, quartz, liquid crystal glass, magnetic materials, jewelry and jade materials, ceramic materials and other hard and brittle new materials cutting, rough grinding, fine grinding. At the same time, it can also be used to produce electroplated diamond precision grinding wheel, SiC crystal cutting fluid, ultra-thin dicing knife, etc.
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